JPH0158851B2 - - Google Patents
Info
- Publication number
- JPH0158851B2 JPH0158851B2 JP8922483A JP8922483A JPH0158851B2 JP H0158851 B2 JPH0158851 B2 JP H0158851B2 JP 8922483 A JP8922483 A JP 8922483A JP 8922483 A JP8922483 A JP 8922483A JP H0158851 B2 JPH0158851 B2 JP H0158851B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- capacitor
- dielectric
- polyethylene terephthalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 36
- 239000003990 capacitor Substances 0.000 claims description 34
- -1 polyethylene terephthalate Polymers 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 229920006015 heat resistant resin Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004962 Polyamide-imide Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims description 4
- 239000011104 metalized film Substances 0.000 claims description 4
- 229920002312 polyamide-imide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000005476 soldering Methods 0.000 description 9
- 238000007654 immersion Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920000134 Metallised film Polymers 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8922483A JPS59215714A (ja) | 1983-05-23 | 1983-05-23 | フイルムコンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8922483A JPS59215714A (ja) | 1983-05-23 | 1983-05-23 | フイルムコンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59215714A JPS59215714A (ja) | 1984-12-05 |
| JPH0158851B2 true JPH0158851B2 (en]) | 1989-12-13 |
Family
ID=13964757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8922483A Granted JPS59215714A (ja) | 1983-05-23 | 1983-05-23 | フイルムコンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59215714A (en]) |
-
1983
- 1983-05-23 JP JP8922483A patent/JPS59215714A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59215714A (ja) | 1984-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3457478A (en) | Wound film capacitors | |
| JPH0569290B2 (en]) | ||
| JP2993909B2 (ja) | コンデンサの製造方法 | |
| JPH0158851B2 (en]) | ||
| JPH0563928B2 (en]) | ||
| JPH0130286B2 (en]) | ||
| JPH0142617B2 (en]) | ||
| JPS59127828A (ja) | チツプ状フイルムコンデンサ− | |
| JPH06251991A (ja) | プラスチックフィルムコンデンサ | |
| JPS5936920A (ja) | フイルムコンデンサ− | |
| JPH0461485B2 (en]) | ||
| JPH04105310A (ja) | 積層セラミックコンデンサ | |
| JPH04329616A (ja) | 積層形電子部品 | |
| JPS6032750Y2 (ja) | コンデンサ | |
| JPH04152614A (ja) | チップフィルムコンデンサの製造方法 | |
| JPH03241804A (ja) | チップ形金属化フィルムコンデンサ | |
| JPH04152613A (ja) | チップ型金属化フィルムコンデンサとその製造方法 | |
| JPH0510348Y2 (en]) | ||
| JPH0770428B2 (ja) | コンデンサ | |
| JPS61119024A (ja) | 積層コンデンサ | |
| JPH04287307A (ja) | 面実装形積層フィルムコンデンサの製造方法 | |
| JPS637451B2 (en]) | ||
| JPH03293709A (ja) | チップ型フィルムコンデンサ | |
| JPS6356694B2 (en]) | ||
| JPH02296312A (ja) | 電子部品およびその製造方法 |